Printed Circuit Board
Types
Materials
FR4 (Standard Thickness 0.8, 1.0, 1.6, 2.0,
2.4, 3.2mm)
Aluminium (Thermal Clad) (Standard Thickness 1.0, 1.6, 2.0, 3.2mm)
Copper Weight
½, 1, 2, 3 oz/ft
152, 305, 610, 915 grms/M
Surface Finish
Tin/Lead (roller tinned, fused, hot air level)
Gold (immersion or electro-plated)
Silver (immersion or electro-plated)
Nickel (immersion or electro-plated)
Nickel/Gold (immersion or electro-plated)
Palladium/Nickel (electro-plated)
Carbon Pads, Sterling Immersion Silver (a lead free alternative
to hot air solder levelling)
Bare Board Electrical Test - All Types
Scoring - Data Sheet Available
Photo Plotting - All Data can be Accommodated
Single
Sided
Double Sided
Double Sided Plated Through
Multilayer (12 Layer Maximum)
Surface
Mount
Conventional
Mixed Technologies
Aluminium (Thermal Clad)
